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Voltage Regulator Data Sheet IFX1117 Features * * * * * * * * Output voltage 3.3 V or adjustable 1.0 A output current Low drop voltage < 1.2 V @ 800 mA Short circuit protected Overtemperature protected Operating range up to 15 V Industrial type Green Product (RoHS compliant) For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series. Functional Description The IFX1117 is a monolithic integrated fixed NPN type voltage regulator that can supply loads up to 1.0 A. The device is housed in the small surface mounted SOT223 package. The IC is equipped with additional protection against overload, short circuit and overtemperature. The IFX1117ME V33 supplies a regulated output voltage of 3.3 V (2%). The IFX1117ME V supplies an output voltage with 2% precision adjustable via an external voltage divider. The input voltage for the IFX1117ME V33 ranges from 4.5 V (= VQ+VDR) to 15 V for a load current of 800 mA, for the maximum load current of 1.0 A a minimum input voltage of 4.7 V is required. The drop voltage VDR ranges from 1.1 V to 1.4 V depending on the load current level. The device operates in the temperature range of Tj = 0 to 125 C. Type IFX1117ME V33 IFX1117ME V Data Sheet Package PG-SOT223 PG-SOT223 1 Marking 111733 1117V Rev. 1.0, 2011-02-24 IFX 1117 I Q Control with Overtemperature Protection; Overcurrent Protection Internal Reference GND AES02840 Figure 1 Block Diagram for Fixed Output Voltage IFX1117ME V33 Data Sheet 2 Rev. 1.0, 2011-02-24 IFX 1117 SOT223 Q 4 1 2 3 GND Q I AEP02868_1117_01 Figure 2 Table 1 Pin No. 1 2 3 4 (TAB) Pin Configuration IFX1117ME V33 (top view) Pin Definitions and Functions IFX1117ME V33 Symbol Function GND Q I Q Ground Output; Connect output pin to GND via a capacitor CQ 10 F with ESR 20 (see also graph "Region of Stability") Input Output; Connect to pin 2 and heatsink area on PCB Data Sheet 3 Rev. 1.0, 2011-02-24 IFX 1117 SOT223 Q 4 1 2 3 ADJ Q I AEP02868_1117_02 Figure 3 Table 2 Pin No. 1 2 3 4 (TAB) Pin Configuration IFX1117ME V (top view) Pin Definitions and Functions IFX1117ME V Symbol Function ADJ Q I Q Adjust; defines output voltage level by external voltage divider between Q, ADJ and GND. Output; Connect output pin to GND via a capacitor CQ 10 F with ESR 20 (see also graph "Region of Stability"). Input Output; Connect to pin 2 and heatsink area on PCB Data Sheet 4 Rev. 1.0, 2011-02-24 IFX 1117 Table 3 Parameter Absolute Maximum Ratings Symbol Limit Values Min. Max. 20 20 20 - 2 V V V - kV - - - Internally limited Human Body Model Unit Test Condition Input - Output Voltage Difference (variable device only) Voltage Voltage Output Voltage Current ESD Rating Electrostatic discharge voltage Temperature Storage temperature Junction temperature VI - VQ VI VQ IQ VESD -0.3 -0.3 -0.3 - -2 Input Voltage (fixed voltage version only) Tstg Tj -50 -40 150 150 C C - - Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4 Parameter Input Voltage Junction temperature Table 5 Junction ambient Operating Range Symbol Limit Values Min. Max. V C K/W K/W K/W - - PG-SOT223, footprint only. PG-SOT223, 300 mm2 heat sink area - 125 164 81 4 Unit Remarks VI Tj Rthja VQ + VDR 15 0 - - Thermal Resistance Junction case Rthjc - Note: In the operating range, the functions given in the circuit description are fulfilled. Data Sheet 5 Rev. 1.0, 2011-02-24 IFX 1117 Characteristics 3.3 V Fixed Output Voltage Device IFX1117ME V33 0 C < Tj < 125 C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Output voltage Output voltage Line regulation Load regulation Drop voltage Symbol Limit Values min. typ. max. V V mV mV mV V V V V mA mV % ppm dB 0 mA IQ 800 mA 4.7 V VI 10 V 0 mA IQ 1000 mA; 4.7 V VI 15V 4.7 V VI 15V 0 mA IQ 800 mA;1) 0 mA IQ 1.0 A1) 3.23 5 - - - - - - - - - - - - 60 3.300 3.36 5 3.300 - 1 1 2 1.00 1.05 1.10 1.30 5 16.5 0.3 30 65 6 10 - 1.10 1.15 1.20 1.40 10 - - - - Unit Measuring Conditions VQ VQ VQ VQ VDR Drop voltage VDR Drop voltage VDR Drop voltage VDR Current consumption; Iq Iq = II - IQ Temperature stability Long Term Stability Current limit RMS Output Noise Power Supply Ripple Rejection VQ - IQ = 100 mA2) IQ = 500 mA2) IQ = 800 mA2) IQ = 1.0 A2) IQ = 10 mA 3) 3) IQmax - 1100 - 2250 mA PSRR VQ = 0.5 V ppm of VQ, Tj = 25 C 10 Hz f 10 kHz3) fr = 120 Hz, Vr = 1 VPP3) 1) Measured at constant junction temperature 2) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. 3) Specified by design; not subject to production test. Data Sheet 6 Rev. 1.0, 2011-02-24 IFX 1117 Characteristics Adjustable Output Voltage Device IFX1117ME V 0 C < Tj < 125 C; VI = 5 V, IQ = 10 mA; unless otherwise specified. Parameter Reference voltage Output voltage Line regulation Load regulation Drop voltage Drop voltage Drop voltage Drop voltage Minimum Load Current 4) Adjust Current Adjust Current Change Temperature stability Long Term Stability Current limit RMS Output Noise Power Supply Ripple Rejection Symbol Limit Values min. typ. max. V V %1) %1) %1) V V V V mA A A %1) % 1) Unit Measuring Conditions 10 mA IQ 800 mA; 1.4 V (VI-VQ) 10 V 10 mA IQ 1000 mA; 2.65 V VI 15 V 1.5 V (VI-VQ) 13.75 V 10 mA IQ 800 mA;2) 10 mA IQ 1.0 A 2) VQ VQ VQ VQ 1.22 5 - - - - - - - - - - - - - - 65 1.250 1.27 0 1.250 - 0.035 0.2 0.2 0.25 1.00 1.05 1.10 1.30 1.7 100 2 0.5 0.3 30 70 0.4 - 1.10 1.15 1.20 1.40 5.0 120 5 - - - - VDR VDR VDR VDR Iq IADJ IADJ VQ - IQ = 100 mA 3) IQ = 500 mA 3) IQ = 800 mA 3) IQ = 1.0 A 3) VI = 15 V IQ = 10 mA 1.4 V (VI-VQ) 13.6 V; 10 mA IQ 800 mA 5) 5) IQmax - 1100 - 2250 mA ppm dB PSRR VQ = 0.5 V ppm of VQ, Tj = 25 C 10 Hz f 10 kHz 5) fr = 120 Hz, Vr = 1 VPP 5) 1) Related to VQ 2) Measured at constant junction temperature 3) Drop voltage measured when the output voltage has dropped 100 mV from the nominal value obtained at VI = 5.0 V. 4) Minimum load current required to maintain regulation 5) Specified by design; not subject to production test. Data Sheet 7 Rev. 1.0, 2011-02-24 IFX 1117 IFX1117ME V33 II VI CI 100 nF I3 2 Q IQ CQ VQ 1 GND IGND AES02937_1117 Figure 4 Measuring Circuit Application Information IFX1117ME V33 VI CI1 CI2 I 3 2 Q VQ CQ2 1 GND AES02816_1117 Figure 5 Typical Application Circuit IFX1117ME V33 Data Sheet 8 Rev. 1.0, 2011-02-24 IFX 1117 Output The IFX1117 requires a 10 F output capacitor with ESR 20 for the stability of the regulation loop. The use of a tantalum output capacitor is recommended. For the adjustable device IFX1117ME V the output voltage level can be defined by a voltage divider between Q, ADJ and GND. The output voltage calculates: R2 V Q = V REF x 1 + ----- + I ADJ x R 2 R 1 (1) At the input of the regulator a capacitor is recommended to compensate line influences. As a minimum a 100 nF ceramic input capacitor should be used. If the regulator is used in an environment with long input lines an input capacitance of 10 F is suggested. IFX1117ME V VI CI1 CI2 I 3 2 Q VQ CQ2 R1 VQ - VADJ = VREF 1 ADJ IADJ R2 CADJ AES02815_1117 Figure 6 Typical Application Circuit IFX1117ME V Data Sheet 9 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Output Voltage VQ versus Junction Temperature T j VQ-TJ.VSD Dropout Voltage Vdr versus Output Current IQ 1300 Vdr [mV] VDR-IQ.VSD V Q [%] 1.0 I Q = 10 mA 0.0 1100 T j = 25 C 1000 Tj = 125 C -1.0 900 -2.0 800 0 25 50 75 100 125 150 0 200 400 600 800 I Q [mA] Tj [C] Dropout Voltage Vdr versus Junction Temperature Tj 1300 Vdr [mV] VDR-TJ.VSD Maximum Output Current IQ versus Junction Temperature Tj 2.2 I Q [A] IQMAX-TJ.VSD 1100 I Q = 800 mA 1000 I Q = 500 mA I Q = 100 mA 1.8 VQ = 0.5 V 1.6 900 1.4 800 1.2 0 25 50 75 100 125 150 1.0 0 25 50 75 100 125 150 T j [C] T j [C] Data Sheet 10 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Adjust Pin Current IADJ versus Junction Temperature Tj IADJ.VSD Power Supply Ripple Rejection PSRR versus Frequency f 80 PSRR.VSD I A DJ [A] PSRR [dB] IFX1117 ME V VI = 5 V 88 60 IFX1117 ME V33 VI = 8 V IFX1117 ME V33 VI = 5 V 84 50 80 40 76 30 VRIPPLE = 1 V I Q = 10 mA CQ = 10 F Tantalum 100 1k 10k 100k 0 25 50 75 100 125 T j [C] 10 f [Hz] Region of Stability Version ME V33 V33_ESR-IQ.VSD Region of Stability Version ME V V_ESR-IQ.VSD ESR CQ [ ] C Q = 10 F ESR CQ [ ] C Q = 10 F 10 10 1 Stable Region 1 Stable Region T j = 125 C 0.1 T j = 125 C T j = 25C 0.01 0 40 80 120 160 I Q [mA] 0.01 0 40 0.1 T j = 25C 80 120 160 I Q [mA] Data Sheet 11 Rev. 1.0, 2011-02-24 IFX 1117 Typical Performance Characteristics Load Transient Response Version ME V33 V33_dVQ-dIQ.vsd Line Transient Response Version ME V33 V33_dVQ-dVI.vsd VQ [mV] 50 0 -50 -100 VI = 5 V CQ = 10 F Tantalum VQ [mV] 50 0 -50 IQ = 100 mA CQ = 10 F Tantalum VI [V] 5.75 Q [A] 0.6 0.1 0 20 40 60 80 4.75 0 20 40 60 80 t [s] t [s] Load Transient Response Version ME V V_dVQ-dIQ.vsd Line Transient Response Version ME V V_dVQ-dVI.vsd VQ [%] 3 0 -3 -6 VI - V Q = 3 V CQ = 10 F Tantalum VQ [%] 3 0 -3 -6 I Q = 100 mA C Q = 10 F Tantalum VI - VQ [V] 3.5 Q [A] 0.6 0.1 0 20 40 60 80 2.5 0 20 40 60 80 t [s] Data Sheet 12 t [s] Rev. 1.0, 2011-02-24 IFX 1117 Package Outline 1.60.1 0.1 MAX. 4 A 6.5 0.2 3 0.1 B 3.5 0.2 7 0.3 1 2 3 0.25 M A 0.7 0.1 4.6 2.3 0.25 M B 0.5 MIN. 0.28 0.04 0...10 SOT223-PO V04 3.5 1.4 4 1.7 4.8 1.2 1.1 SOT223-FPR V04 1.4 1.4 0.9 SOT223-FPW V04 Footprint Reflow Soldering Footprint Wave Soldering Figure 7 Outline and footprint PG-SOT223 Green Product (RoHS-Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products. SMD = Surface Mounted Device Data Sheet 13 Dimensions in mm Rev. 1.0, 2011-02-24 1.7 4.8 IFX 1117 Revision History Version Rev. 1.0 Date Changes 2011-02-24 Data Sheet Data Sheet 14 2011-02-24 Edition 2011-02-24 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. |
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